Phys.org

Innovative etching method for silicon: Higher precision through interlayer

Innovative etching method for silicon: Higher precision through interlayerWorldPing

In micro- and nanotechnology, highly precise components with tall, narrow structures (high aspect ratios) made from semiconductor materials like silicon are important. A promising fabrication method is gas-phase metal-assisted chemical etching (MacEtch).

This is a short WorldPing brief. The full report was published by Phys.org.

Read the full report at Phys.org

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